Many reports place PIC market growth at a CAGR1 of over 20% until 2025 and even beyond. Because of this, superior automation for both assembly and testing is critical in enabling high-volume ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

According to Siemens, the acquisition will allow it to integrate Aster's circuit-testing capabilities into its own portfolio.

Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That’s ...